| FlipChip International, LLC |  | FlipChip International, LLC provides merchant wafer level packaging and flip chip bumping services to the semiconductor industry. Its wafer level services include standard flip chip (SFC), redistributed SFC, Wafer UltraCSP, e-less nickel bumping WLCSP, Polymer Collar, and high frequency RF packaging; and die level services comprise dicing, optical inspection, pick-and-place, waffle-pak, tape and reel, wafer sawing, wafer probe, wafer sort, test, die trays, and ship direct of finished die to end customer. The company also performs services in various categories, which include product qualification, reliability testing, failure analysis, material characterization, and technical/expert reports. FlipChip International, LLC has strategic partnership with Semiconductor Manufacturing International Corporation. The company was incorporated in 2004 and is headquartered in Phoenix, Arizona. As of February 10, 2004, FlipChip International, LLC operates as a subsidiary of RoseStreet Labs LLC. | | Visit Website | | Office Address | 3701 E. University Drive,
Phoenix, AZ, 85034 USA | | Phone | (602) 431-6020 | | Fax | (602) 437-2739 | | Executives | Bob Forcier, President and CEO | | Ted Tessier, CTO |
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