| Advanced Semiconductor Engineering, Inc. |  | Advanced Semiconductor Engineering, Inc. was founded in 1984 and is based in Kaohsiung, Taiwan. Advanced Semiconductor Engineering, Inc., together with its subsidiaries, provides semiconductor packaging and testing services for semiconductor companies. Its services include semiconductor packaging; design and production of interconnect materials; front-end engineering testing; and wafer probing and final testing services. The company offers various leadframe-based package types, such as quad flat package, thin quad flat package, and bump chip carrier and quad flat no-lead package; package types based on substrates, including flip-chip BGA and other BGA types; and wafer-bumping products. Its testing services comprise front-end engineering testing, wafer probing, and final testing of logic/mixed-signal/radio frequency and memory semiconductors, as well as other test-related services, such as burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The company packages semiconductors for use in a range of end-use applications, including communications, computers, consumer electronics, industrial, automotive, and other applications. It sells its products primarily in Taiwan, the United States, Asia, and Europe. | | Visit Website | | Office Address | 26 Chin 3rd Rd., N.E.P.Z.,
Nantze, Kaohsiung, Taiwan | | Phone | +886-7-361-7131 | | Fax | +886-7-361-4546 | | Executives | Mr. Jason C. S. Chang, Chairman & Chief Exec. Officer | | Mr. Richard Hung-Pen Chang, Vice Chairman |
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